Nine New Features in v9 That Will Speed You Up
There are dozens of new features in CFdesign implemented to strengthen and expand
Blue Ridge Numerics' industry leading Upfront CFD technology platform. Of particular interest are the ones that will make your next CFD project faster, easier, and more
efficient than ever before.
1. The Accelerant™ Solver
The new Accelerant Solver within CFdesign V9 uses proprietary CPU optimization
algorithms to radically reduce the time it takes to achieve fully converged fluid-flow and heat-transfer solutions. Testing conducted by Blue Ridge Numerics and CFdesign
customers show that simulation results for simple models can be generated 40 percent faster than in previous versions and extremely complex simulations can be completed
up to 2,000 percent faster.
V9 intelligently assigns mesh size based on curvature, geometric gradients, and proximity to neighboring features.
The new Rules on Parts feature in v9 intelligently detects MCAD part names within an assembly and automatically assigns volumetric boundary conditions and material properties.
2. Auto Mesh Sizing
By completely skipping the Mesh dialog from your analysis set-up, the mesh distribution
will be computed automatically when the analysis is started. Auto mesh sizing performs
a comprehensive topological interrogation of the geometric model, assigning mesh sizes
based on curvature, geometric gradients, and proximity to neighboring features. An
optimally sized surface and volume mesh ensures faster mesh generation and
higher-quality simulation results.
3. Rules on Parts
Intelligently detects MCAD part names within an assembly and automatically assigns
volumetric boundary conditions and material properties. Boundary conditions include
heat generation and total heat generation, both of which can be steady-state, transient
or temperature dependent. Materials are assigned from CFdesign's customizable library
of fluids, solids, printed circuit boards, and the newly added two-resistor electronic
components.
4. Geometry Diagnostics
Interrogates geometry to identify areas that may cause difficulty in the determination
of mesh sizes, the mesh generation, and even in solution stability of the analysis.
V9 also identifies regions of the model that are quited for extruded meshing. Upon hitting the 'Go' button the model is automatically meshed with an optimal blend of mesh sizes and shapes.
5. Extruded Meshing
This function stretches triangular faces into multiple layers of wedge (prism) elements through the length of 3-D parts with a uniform cross section. This feature can greatly
reduce element count in high aspect-ratio parts, and improve flow accuracy in models
dominated by form drag, such as pipe flow.
6. Forced Convection Automation
Press 'GO' on the Analyze dialog and the analysis will run first as Flow-only until
convergence is achieved. Flow will then be disabled and heat transfer enabled
automatically to deliver a fully coupled forced convection solution.
7. Internal Fan Velocity Profile Import
Allows the specification of the velocity profile for an internal fan. It provides a
mechanism to apply the velocity distribution computed from a detailed rotating region
analysis to a simple geometric representation of that fan in a subsequent system-level
analysis.
8. PCB Characterizer
Provides a simple way to accurately include thermal characteristics of any PCB material within a CFdesign simulation. The unique properties of each copper and dielectric (FR-4) layer are specified, allowing conductivities to be computed automatically and applied
within the simulation. Each characterized PCB can be added to the CFdesign material
library for re-use, and can be automatically assigned with the new rules on parts
functionality.
The ability to quickly characterize the thermal performance of PCB's and IC's allow engineers to find reliable
thermal design strategies.
9. Compact Thermal Model
Only two parameters, Theta JB and Theta JC, are needed to supply board temperature,
junction temperature, case temperature, heat transfer between junction and board, and
heat transfer between junction and case for every component within the system.
Supported microchip configurations include BGA (ball grid array), PBGA (plastic ball
grid array), TBGA (taped ball grid array), FC-BGA (flip chip ball grid array), QFP
(quad flat pack), PQFP (plastic quad flat pack), NQFP (no-lead quad flat pack), and
SOIC/SOP (small-outline IC/small-outline package).
