Electronics

Thermal design challenges in electronics systems can determine the success or failure of a product. Inadequate heat removal can lead to reduced system life, excessive touch temperatures, and component failure or loss of its physical integrity.

Physical testing of multiple designs in a broad range of environmental operating conditions is both expensive and time consuming, often causing projects to miss deadlines and exceed budgets.

CFdesign enables you to conduct a rapid design investigation of an electronics system’s performance by incorporating all the critical parts involved with thermal management including; chips, fans, printed circuit boards, EMI shields, vents, enclosures, power amplifiers, FETs, and more.
   
Your existing CAD system is leveraged as the hub for conducting multi-scenario design studies. CATIA, CoCreate, Inventor, NX, Pro/Engineer, SolidWorks, Solid Edge, SpaceClaim.

• Improve system performance
• Determine component junction temperature
• Maximize coolant (e.g. air, water) flow
• Minimize pressure drop
• Guide selection of the most efficient, effective cooling method
• Focus maximum cooling where most needed
• Meet Touch temperature
• Study effects of solar loading
• Optimize component placement
• Transient thermal response
• Reduce cost, prototyping efforts and time to market

Customer Success Stories

	Hirschmann Automation and Control GmbH offers a complete, integrated infrastructure for data communication throughout the customer enterprise. This respected global company is recognized for innovative, high-quality industrial Ethernet and electronic control systems such as their Octopus Series. Read Full Brief
	Macrolink uses CFdesign to conduct early-stage flow and thermal analyses on ruggedized electronics enclosures for avionic, mobile and fixed applications. They engineer rugged ATR chassis, COTS chassis, portable rugged workstations and SCSI & Fibre Channel storage systems to meet the most demanding environmental requirements. Read Full Brief
	Xan3D Technologies Hybrid IC processes can compress what are today's modules, and even systems, down to individual chips. On a new project, preliminary design evaluations done in CFdesign revealed that traditional fin and pin fin heat sink design configurations simply could not keep the maximum case temperature below 80° C. A new revolutionary heat sink design was created using SolidWorks® and CFdesign. Read Full Brief
	Packaging powerful 4D digital imaging functionality and voice-activated controls within a compact, ergonomic design, the iU22 from Philips Medical is truly a next-generation ultrasound system. Read Full Brief