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One of the basic concepts of electronics cooling is effective transfer of heat from semiconductor devices to the ambient using heat sinks or other cooling technologies.
Spreading resistance occurs whenever a small heat source comes in contact with the base of a larger heat sink. The heat does not distribute uniformly through the heat sink base, and consequently does not transfer efficiently to the fins for convective cooling.
Advanced Thermal Solutions, Inc. uses CFdesign to develop innovations such as their Forced Thermal Spreader to control, reduce, and spread thermal resistance in electronics systems.
This 5-page technical report provides valubale insight on the subject based on extensive studies conducted by ATS.
Click here to download the report.
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